Hypermer™ KD99S: advanced dispersant for high-performance thermal management

As electronic devices become more powerful and compact, the demand for efficient thermal management continues to rise. High-performance thermal interface materials are critical to maintaining reliability, safety, and longevity in advanced applications, from power electronics to EV systems.

To meet this challenge, we are proud to introduce Hypermer™ KD99S, a new polymeric dispersant engineered to deliver outstanding performance in high-solids, silicone-based thermal formulations.

Designed for High-Performance Thermal Systems

Hypermer™ KD99S is a 100% active polymeric dispersant specifically developed for silicone based systems containing oxides, nitrides, and metal fillers.

Its advanced chemistry enables formulators to create highly stable, uniform dispersions, even at elevated filler loadings, unlocking new levels of thermal conductivity without compromising processability.

Key Benefits at a Glance

Achieve Lower Viscosity at High Filler Loadings

Thermal management formulations often require high filler content to maximise heat transfer, but this can lead to difficult processing and high viscosity.

Hypermer™ KD99S significantly reduces viscosity in filled silicone systems, even at demanding loadings, ensuring smoother processing and better application performance.

Enhance Dispersion Stability

Maintaining a stable particle distribution over time is critical for product reliability. Hypermer™ KD99S helps prevent particle agglomeration, delivering consistent particle size distribution and long-term stability.

Optimise Processing Efficiency

By improving dispersion quality and reducing viscosity, the product supports easier mixing, pumping, and application, helping streamline manufacturing and reduce energy input.

100% Active for Maximum Efficiency

As a fully active dispersant, Hypermer™ KD99S contributes directly to formulation performance without introducing additional solvents or diluents.

Proven Performance in Silicone-Based Systems

Application testing demonstrates the impact of Hypermer™ KD99S:

• Significant viscosity reduction in aluminium nitride dispersions at around 2 wt% addition
• Optimised dispersant demand for both aluminium nitride and aluminium oxide systems
• Improved long-term stability, maintaining a narrow particle size distribution over time

These benefits translate directly into more reliable, high-performance thermal materials.

Enabling Advanced Thermal Applications

Hypermer™ KD99S is ideally suited for a wide range of demanding applications, including:

• Thermal greases
• Gap fillers
• Thermal coatings, adhesives, and sealants
• Electronic encapsulants
• Power electronics and advanced semiconductor systems

Supporting Innovation in Thermal Management

With increasing performance demands across industries such as electric vehicles, renewable energy, and high-performance computing, formulators need solutions that balance thermal performance, processability, and stability.

Hypermer™ KD99S enables precisely that, helping you develop next-generation thermal interface materials with confidence.